- Joined
- Jul 29, 2011
- Location
- Buenos Aires, Argentina
Which is most likely a bad application...from what I've seen so far. It's quite simple really, thermal transfer is better, w/mk is MUCH higher and you're moving heat from a small surface area to the ihs. The paste with higher w/mk will perform better.
EDIT: There are also some newer IB chips with better stock contact between die and ihs though...
EDIT: There are also some newer IB chips with better stock contact between die and ihs though...