From reading recient threads there seems to be a LOT of confusion about just what the differences are between the older D1 steping and newer M0 steppings.
I'm posting this thread to highlight what Intel is saying about them.
I do NOT intend to claim any real knowledge about just how overclockable each is. Check other threads for that.
In a nutshell, any CPU with an M0 stepping is an EE core chip, but obviously having the L3 cache crippled.
I'd susgest going to
http://processorfinder.intel.com/scripts/default.asp
Then first select the EE family and check Sspec's; Then the Pentium 4 family, list all and scan for M0.
They seem to share a new copper heat spreader on the inside of the current integrated heat spreaded.
This seems to be bonded to the die by what is described as "solder" or "epoxy", by those who have sadly tried to remove the heat spreader.
I believe this will also be the standard used in Prescott and Tejas.
Conjecture: Seeing just what a blast-furnace the "real" EE chips are, this may be Intels solution to better cooling with air.
See the article: http://www.vr-zone.com/?i=308&s=1
Intel also states that D1 stepping is NOT being discontinued, 'though packageing will change.
Further conjucture: IMHO the M0's are the result of Intel having lousey yealds on the EE, and this is a way to dump bined CPUs. Therefore, they may disappear as quickly as they have arrived!
OK, thats what I have been able to find.
Some may be WRONG.
And ALL of it was scatered here and there in other threads by other people. They did the really hard work.
Hope this helps and Please feel free to correct anything I've screwed up here!
I'm posting this thread to highlight what Intel is saying about them.
I do NOT intend to claim any real knowledge about just how overclockable each is. Check other threads for that.
In a nutshell, any CPU with an M0 stepping is an EE core chip, but obviously having the L3 cache crippled.
I'd susgest going to
http://processorfinder.intel.com/scripts/default.asp
Then first select the EE family and check Sspec's; Then the Pentium 4 family, list all and scan for M0.
They seem to share a new copper heat spreader on the inside of the current integrated heat spreaded.
This seems to be bonded to the die by what is described as "solder" or "epoxy", by those who have sadly tried to remove the heat spreader.
I believe this will also be the standard used in Prescott and Tejas.
Conjecture: Seeing just what a blast-furnace the "real" EE chips are, this may be Intels solution to better cooling with air.
See the article: http://www.vr-zone.com/?i=308&s=1
Intel also states that D1 stepping is NOT being discontinued, 'though packageing will change.
Further conjucture: IMHO the M0's are the result of Intel having lousey yealds on the EE, and this is a way to dump bined CPUs. Therefore, they may disappear as quickly as they have arrived!
OK, thats what I have been able to find.
Some may be WRONG.
And ALL of it was scatered here and there in other threads by other people. They did the really hard work.
Hope this helps and Please feel free to correct anything I've screwed up here!