- Aug 14, 2014
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I read the article and I don't see how you can get bubbles unless the paste is globbed on. I use a credit card and spread a rice sized portion over the entire card and end up probably wiping half off leaving me with a smooth & very thin coating. I've never seen an air bubble.
Is it really time consuming for people to spread paste? What's it take 30 seconds? 60?
I know what he said.Which isn't what he said
I'll just stick to not spreading paste and letting the heatsink do it... lol!
I know what he said.
I was just mentioning the plastic bag because this is the old school method.
Sometimes you have to spread by hand. If you do not get 100% coverage on the older CPU's that take 2-4v vcore, they will cook as soon as you turn the power on. Bare die CPU's should be covered 100% also. 1 hot spot will kill it in a second.
Oh, I agree, legacy hardware is 100% different from our modern hardware. Especially anything bare die, but it's also easier to cover a die than an IHS.
The legacy hardware is no different than current. You use the spread method when renewing thermal compound under Intel IHS. I do the same spread method with de-lidded AMD chips and block to die applications. (and have done quite a few Intels too)