New to the board, my first attempt to watercool using the Thermaltake M360 Plus Kit. Once the system was complete, I filled the reservoir and let the system bleed (with refill cap opened). Once the air is out, I close the fill port and within 24 hours the system builds up too much pressure and disconnects from one of the fittings. This happens when the pump is running and even when it's not. The location of the leak is different every time. So far I had to RMA the motherboard and Ram. I'm not sure why it continues to leak or builds up too much pressure even when the pump is turned off. Please check out the pictures and tell me what i'm doing wrong. Thanks