What thermal material is used on an OEM Celeron Slot 1 processor?

[Posy Rorer]

I have an OEM Celeron 400 Slot 1 CPU in a SEPP package. I'm wondering if it is thermal tape that is used by Intel to bond the CPU to the heatsink. I could remove the heatsink from chip to check underneath and see, but I'm hesitant to do this because it seems like a really solid bond, and by breaking the bond, I don't think I will be able to put it back together as efficiently as it originally was. The reason I would like to know whether thermal tape is originally used, is because I understand that thermal grease is better than tape. So can anyone tell me if it is advisable to break the thermal bonding on a Celeron Slot 1 SEPP CPU by removing the heatsink, and apply thermal grease (Radio Shack) in place of what is there?

 

[Revx]

Hmm well if it's OEM then you really can't say, because that's where the reseller cut's in and puts what they want. I Know way back when i bought a pIII slot 1 it had normal thermal goop between the heatsink and the processor. But either way, id take the heat sink off(assuming it can be reattached) and pop on some ASII or ASIII

 

[stool]

Welcome to the forums.
Thermal tape isn't as good a heat conductor as thermal grease. I would recommend removing tape and replacing it. Even the Radio Shack thermal grease is better than the tape. Celerons are fairly tough, so you can carefully scrape any thermal tape off(i use a razor blade), then duff it up with some isopropyl alcohol. If you are adventurous, you could even consider lapping it slightly, to get a great seal between the CPU and HSF.