SUMMARY: One approach to lowering case temps.
One of the things I love about Computex is you get to see all manner of computer gear. As case temps increasingly rise due to elevated CPU, GPU and other heat sources, the resulting cooling challenge engenders traditional and not so traditional approaches to the problem.
Air conditioning the air coming into the case is one that’s been tried in a variety of ways, and I saw two examples of the show floor.
One approach is to cool incoming CPU air only – KM Korea took this route and uses a TEC to cool air to the CPU only. The power supply is divided into two parts – one for system power and one to cool incoming air:
The duct directs cool air into the CPU fan directly:
I have asked for a sample to test – an interesting idea.
Another approach is to cool all incoming air into the case – Sytrin has developed such an system – at the front bottom of their case sits a TEC air conditioner:
Incoming air is cooled by the copper fins seen above; hot air from cooling the TEC is exhausted through the bottom of the case.
The cooling module is shown below:
Another product fits into a CD ROM slot with the same idea – cool incoming air:
This could be used in any case, as it’s a stand-alone unit:
Without testing any of these units, I can’t tell you that it’s an effective approach. However, it would seem to me that spot cooling of the KM Korea type would be more cost effective than cooling the entire case. I would also be concerned about condensation, but both vendors assure me that it’s not a problem.
At a minimum, innovation is alive and well at Computex.