Heatsink Test – Joe
SUMMARY: Low noise, good performance and a compact footprint.

The good guys at Spire were nice enough to send a sample of the SP601B3 VertiCool II ™ heatsink for a test spin.
Key Features:
- Copper base with dual copper heatpipes, forty five aluminum fins
- Fan 2300 rpm, 19.0 dBA, 26 cfm
- Mounting for Intel Celeron D, Pentium 4, Pentium D, Pentium EE, AMD Athlon 64, FX 51, FX 53, FX55, Opteron, Sempron
- Fan rated 2300 rpm, 25.8 cfm @ 19 dBA
There is a lot of fin area on this heatsink, as a rear view shows:

The base is polished; I used the Poor Man’s Flatness Test on it with good results:

The center appears reasonably flat while there is some fall-off at the edges:

Mounts included with the heatsink, plus the ubiquitous white goop:

I tested the Spire VertiCool II using the CPU Large Die Tester. Noise was measured 8″ from the fan’s intake with a Radio Shack sound meter; 50 dBA at this distance is very quiet 3 feet from the fan.
Test | Die Temp | Ambient Temp | C/W |
Spire VertiCool II, <50dBA | 34.3 | 19.6 | 0.21 |
Fan noise is very low – this is a very quiet heatsink. Results place the Spire’s VertiCool II in the mid rank of heatsinks tested to date (Heatsink Ranking).
I also tested it on an Asus P5WD2 motherboard P4 Motherboard Test Platform with a modified Pentium D 805 to read CPU case temps (both supplied by Directron), with the following results:
Heatsink | Case Temp | Ambient Temp | C/W | On-Die Temp¹ |
Spire VertiCool II, <50dBA² | 44.0 | 24.4 | 0.21 | 54 |
¹MBM on-die temperatures.
²50 dBA measured 8″ from the fan intake corresponds to about 30 dBA measured 3 feet from the fan, a very quiet noise level.
A bit of a surprise – I did not expect performance to be as well as it tested – I think the large fin area greatly aided performance. Low noise, good performance and a compact footprint – what’s not to like?? Not for aggressive cooling, but a very good choice for a work/home utility PC.
Thanks again to Spire for sending this our way.
Disclosure: Joe Citarella has a financial interest in a company developing thermosyphon products for electronic chip cooling.
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