- Joined
- Jul 20, 2005
- Location
- Chicago, IL
I should be receiving my board either today or tomorrow and I will immediately install it. However I want to install new thermal compound under all the heatsinks pretty soon after Im' up and running (I know I'll need to remove the board.) I'll be using AS5 on the heatsinks, but Ive heard that under some components (like the MOSFETs?) I would have to use a completly non-conductive compound like AS Ceramique or I could fry something. Can anyone clarify this?