White Wind
New Member
- Joined
- Mar 22, 2014
Hi, I'm gonna delid and watercool a 4670k and I'd like to know what's the best way to go ( temps-wise ). The infos I can find contradict themselves so I don't know what to do and what will be the coolest :
- CLU between die/IHS and CLU between IHS/block ?
- CLU between die/IHS and prowled thermal grease between IHS/block ?
- prowled thermal grease between die/IHS and CLU between IHS/block ?
- prowled thermal grease between die/IHS and prowled thermal grease between IHS/block ?
- CLU between die/block ( no IHS ) ?
- prowled thermal grease between die/block ( no IHS ) ?
..assuming the grease chosen is the best of its kind.
I would have thought there would be a consensus on that question, but it seems that not... even amongst tests the results go both way
- CLU between die/IHS and CLU between IHS/block ?
- CLU between die/IHS and prowled thermal grease between IHS/block ?
- prowled thermal grease between die/IHS and CLU between IHS/block ?
- prowled thermal grease between die/IHS and prowled thermal grease between IHS/block ?
- CLU between die/block ( no IHS ) ?
- prowled thermal grease between die/block ( no IHS ) ?
..assuming the grease chosen is the best of its kind.
I would have thought there would be a consensus on that question, but it seems that not... even amongst tests the results go both way