All those that praise the low heat output of the 90nm G5 need to take a serious look at the new 2.5GHz PowerMac G5 . . . They had no CHOICE but to implement water cooling. 90nm will lower heat output at the low end. But all three major manufacturers (IBM, Intel and AMD) have made it clear that they end up with very close to a runaway heat monster when they crank up speeds. So I think anyone with dreams of overclocking these things might want to seriously reconsider . . . At low speeds, I agree, these probably won't be problematic when it comes to cooling. They might run a tad hotter than the highest-end model today if they follow the heat output of current mobiles. My fear is that they'll have difficulty ramping these things up, due to cost, complexity, and yields. I hardly think AMD is going to have an easier time than Intel in making fast 90nm processors IN BULK. Add in another core, and the chances of yielding a good crop at competitive speeds seems pretty small. Given that, prices will most certainly be higher than current models, and considering the price of materials and die size, it's going to cost more to make, too. I'm not suggesting I have any clue what the prices are going to be, but it only makes sense. What's the size of a dual core 90nm die? If it's sharing cache, it'll obviously be smaller than twice the size of a single core, but I can't imagine that it will be less than the current die size.
Z