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Personally, I think the advantages and disadvantages of each come out almost even.
My rule of thumb is simply this. If the difference between the two is more than $20, I would go with Sandy. If it's smaller, go with Ivy.
yea i dont think they would need to solder them ether considering most people who get lga2011 boards are probably going to be running great coolers anyways.
but just the same im sure they will use solder do to public opinions.
Who is to say what Intel will come out with in 2 years for the 2011. Of course we know what is on the horizon, but just like Ivy bridge was a new concept not too long ago, there may be even newer developments to come. Engineers don't just sit on one theory as time moves on. A solution without solder, higher voltages, and more thermal resistance is only a matter of innovative thought, and considering the chipset is larger than the 1155/1366, there is more space considerations. There may be 8 or 10 cores to come. Now imagine that, an octocore processor running 8 dimms.
We are ALL on a need to know basis.
Intel is pretty open about their timeline...
EDIT: Okay, maybe they're good at making powerpoint slides with lots of information and we're good at stealing them.
http://www.google.com/search?hl=en&...ntel+roadmap+2013&spell=1&biw=533&bih=295#p=0
They are internal powerpoints that are leaked to the public, not published.