Hi Folks
As evidenced by my lack of benching activity, am having trouble running longer sessions with the cascade. I tape the cpu down with electrical tape...good seal. Fill the gaps with eraser. Eraser the top of the board all around the cpu holdown and out to the ram slots, heatsinks, etc. Apply some eraser to the back of the board the way Woomack described in Johan's thread. Shop towel gasket around the cpu. Layer of armaflex across the bottom, etc, etc. I use ~2.25" of stacked, dense neoprene gaskets then fit the evap/clamshell (which is 2") inside the gaskets and clamp it down tight. Wrap everything around the assembly with shop towels. Really take my time with the insulation job so it's frustrating when things start going whacky after 1-5 hours :/
Don't see any condensation. Really wondering if it's the eraser that's the problem. Always get a good seal between the evap head and cpu but have noticed that the head makes contact with some of the eraser (the evap head is larger than the cpu and there's a little space between the edges of the cpu and the shop towel gasket).
So...if LET is applied across the top and bottom of the board, will I still need to use eraser or would I still need to use eraser around the cpu holdown assembly? Being as exposed metal is bad, are there any alternatives to eraser?
Hoping to get some time tomorrow so will try re-cutting some cpu shop towel gaskets that come much closer to the edges of the cpu. Except for the head touching the eraser I can't think of anything else that I'm doing wrong over here :/
Could definitely use thoughts to help me fix this issue once and for all. TIA!!
As evidenced by my lack of benching activity, am having trouble running longer sessions with the cascade. I tape the cpu down with electrical tape...good seal. Fill the gaps with eraser. Eraser the top of the board all around the cpu holdown and out to the ram slots, heatsinks, etc. Apply some eraser to the back of the board the way Woomack described in Johan's thread. Shop towel gasket around the cpu. Layer of armaflex across the bottom, etc, etc. I use ~2.25" of stacked, dense neoprene gaskets then fit the evap/clamshell (which is 2") inside the gaskets and clamp it down tight. Wrap everything around the assembly with shop towels. Really take my time with the insulation job so it's frustrating when things start going whacky after 1-5 hours :/
Don't see any condensation. Really wondering if it's the eraser that's the problem. Always get a good seal between the evap head and cpu but have noticed that the head makes contact with some of the eraser (the evap head is larger than the cpu and there's a little space between the edges of the cpu and the shop towel gasket).
So...if LET is applied across the top and bottom of the board, will I still need to use eraser or would I still need to use eraser around the cpu holdown assembly? Being as exposed metal is bad, are there any alternatives to eraser?
Hoping to get some time tomorrow so will try re-cutting some cpu shop towel gaskets that come much closer to the edges of the cpu. Except for the head touching the eraser I can't think of anything else that I'm doing wrong over here :/
Could definitely use thoughts to help me fix this issue once and for all. TIA!!