TOOLS REQUIRED:
One tube thermal compound
One Razor blade (credit card works if you're clumsy)
One Processor Die
DIRECTIONS:
Place single drop of thermal compound on top of die, while held in place by motherboard ZIF socket.
Direct thermal compound across entire surface by aid of a razor blade or other thin flat surface (much as one would when putting grout on a floor for placing ceramic tiles).
When flat, remove all but a 1mm thick layer of compound and replace remaining compound from flat implement, back into thermal compound container.
Attach heatsink, waterblock, shim(s), or evaporator and power on.
On a side note, if you use more than one shim, perform the same action for each shim layer until reaching surface of actual heat exchanger.