Hi
From the 3 or 4 times I've applied the C.Master Shin Etsu compound:
- Heating it slightly does make it a little easier to apply. I don't know whether it's necessary to use very hot water (people have recommended leaving it on top of the television for about 10min). You only want to soften it slightly, as opposed to turning it into a runnier, fluid-like substance.
- After trying the included form (that demarkates the area where the CPU is located), I make my own using some wide cellophane/stationery tape. It does reduce the amount of messing.
- The most effective, but wasteful, approach is to put tiny little blobs (the smallest you can manage, less than 1/2 of a grain of rice) all over the intended area. This area can either marked on the heatsink with a felt-tip marker, or by using the form.
- Use either the included card or something like an old creditcard, to spread the compound.
- Then using firm pressure, slide the card over the blobs to create a layer as smooth and as thin as possible. I've always only moved the card in one direction, to avoid causing holes to form in the layer.
- When spreading, it helps to press your fingertips a little way inwards from the card's edge, so that the pressure is applied from a flat surface, rather than the card's edge (since this could scrape the compound away, instead of spreading it).
Good luck!