Stratus_ss said:
Stratcat said:
if the mating surfaces aren't true.
this being the case what would I do to remedy this?
You would use the process of
LAPPING to make the component with the uneven surface flat.
The above link was the only one I could quickly find on the OCC frontpages, and is a somewhat deeper theoretical article than a more practical based one I saw there, a while ago.
While the link describes several varieties of lapping methods, IMO, the most common & easiest way to lap a CPU or HS, is to get some sandpaper in several grits, starting from, maybe, 200 (if the surface(s) are
really off), to 600 (for a more mild problem). Then work your way thru several higher grits to around 1200 - 1500. Some peeps go to 2000 (if you can find it), which, IMHO, is overkill. Sandpaper is safest for a cpu, 'cuz it's non-conductive, but emery paper does a better (faster/easier) job due to it's being metallic...but Caveat Emptor if you wanna' try emery paper on ur cpu...I wouldn't. But emery is fine for the HS, if it's cleaned up well, afterwards, using an alcohol wash, or something similar. Also emery paper uses a different numbering scheme to specify its grit.
The sandpaper is quickly dipped in plain old water, then placed on a very thick piece of absolutely flat glass that's just had a quick rinse of water, too. The water will keep the sandpaper stuck to the glass, as long as it's reasonably wet.
Then you take the component that's not flat, and as squarely as possible, drag it accross the wet sandpaper. There! You're "Lapping"!!!
There's really a multitude of techniques (back & forth, circular, figure 8's), and each has their proponents.
I had a piece of glass cut for me that's 3/4" thick, & approximately 14" X 18". I got it from a window glass shop, where it was cut off a piece of scrap glass, for 7 bucks, U$D. The shop's owner got a kick out of my explanation for the glass' use, and I advised him on cleaning the air inlets to his store's problematic computer, & advised him to move it out from a very tightly enclosed space under the front counter.
With all due respects to the article's author, I personally wouldn't go too nuts w/the technical aspects of the article (like using lapping compound, or two surface lapping), but just get the glass & some sandpaper, & do one component at a time, like I mentioned. Unless you really want to get into it (I don't, but there are some real perfectionists out there...more power to 'em, & hey, if it's your thing, go for it).
This is NOT an inclusive post on lapping...It is merely a breif overview.
Before you do anything, I would try doing a better search of the forums (there was an excellent "single surface" sandpaper lapping article, somewhere, linked to the frontpage), & maybe Google around the net, too.
Remember: Lapping will void your warranty, unless the component already has a copper finish (your IHS is aluminum coated w/copper underneath, and some HS's are similarly coated). Actually, it technically should void all warranties, but if done correctly on a copper surface (i.e. a Zalman 7000cu), it then becomes an ethical issue on whether you should be able to do an RMA, if required, somewhere down the road, if a problem arises unrelated to your lapping (what-the-hay, if I clean up a manufacturer's defective surface finish, I figure
I'm doing
them a favor).
Also, if you lap your proc, you will loose all your info imprinted on the IHS! You'll have to record & remember what the lapped cpu is!
Anyway, if this is your problem, & you decide to go this route, good luck.
Strat
)
