- Joined
- Aug 12, 2002
i was just thinking. is the die simulator flawed with the P4 benchmarks on overclockers.com or what. when i looked at the test on the page http://www.overclockers.com/tips263/index02.asp i saw that the copper block uses a contact area the same size as an athalon cpu. a p4 has that massive heat spreader. if the die simulator is smaller than an actual p4 chip isnt that going to skew the results. shouldnt there be a seperate copper block with a p4 sized contact area to test p4 heatsinks. maybe there is and i'm an idiot (remind me if i am. only way i will learn)
im not good with words but you know what i mean.
discuss?
also, if you put the p4 heatsink on the die simulator that had the surface area of an AMD would that advantage certain designs over others. can this account for various differences in the heat dispersion reported on the benchmarks as opposed to "real world" situations.
also. one last thing. how can one effectively compare a heatsink that gets .20 with a 70cfm with one that gets .34 with a 20cfm fan. reviews are good with the exception of comparisons being hard to make
im not good with words but you know what i mean.
discuss?
also, if you put the p4 heatsink on the die simulator that had the surface area of an AMD would that advantage certain designs over others. can this account for various differences in the heat dispersion reported on the benchmarks as opposed to "real world" situations.
also. one last thing. how can one effectively compare a heatsink that gets .20 with a 70cfm with one that gets .34 with a 20cfm fan. reviews are good with the exception of comparisons being hard to make