- Joined
- Mar 7, 2008
I'm not mechanically minded. I have in my possession a P4 era Celeron CPU, which I had previously stuck to a heatsink using Arctic Silver Epoxy. I want to extract the die in good condition if possible. I don't care if the rest of the package is destroyed in the process.
So far I've tried to mechanically separate the CPU from the heatsink. In the absence of a vice, I put the edge of the CPU against an external brick wall of my house, and hit the heatsink with a hammer in the hopes of shattering the epoxy. No luck. Now the substrate is looking a bit rough on the edges.
Was Intel still using "solder" in this era? I'm wondering if heating it would help the die/substrate detach from IHS and that would be easier than trying to separate IHS from heatsink.
So far I've tried to mechanically separate the CPU from the heatsink. In the absence of a vice, I put the edge of the CPU against an external brick wall of my house, and hit the heatsink with a hammer in the hopes of shattering the epoxy. No luck. Now the substrate is looking a bit rough on the edges.
Was Intel still using "solder" in this era? I'm wondering if heating it would help the die/substrate detach from IHS and that would be easier than trying to separate IHS from heatsink.