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- Aug 14, 2014
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The "possible damage during shipping" is an interesting take noted in the articles.
Hey ATM - have you ever looked any sort of center of gravity measurements on the large fin-type coolers? Basically, if the COG is too high off the chip, I could easily envision more than 50 lb worth of pressure applied asymmetrically during normal shipping "bumping" for some of the larger fin coolers.
The question to me isn't so much that, but zoom out and look at the big picture...
... why was this not reported with previous generation CPUs that used the same coolers? This seems to be an issue with the substrate the CPU die is on? I mean, those coolers have been around for years.
Right. I read that.. but they also said the 50lb of force is still the same. So, in theory, it shouldn't do that.
Surely. But why didn't they bend previous gen CPUs and this did even though it was rated for the same amount of force?
50lbs of bricks is the same as 50lbs of feathers, right?
Yep, me too. I guess with the thinner substrate, it is allowing (a lot) more deviation...
... but you would like they would have found this in their testing (an underlying point of my statements) and this wouldn't/shouldn't happen...
Are all Skylake boards thinner or is this a vendor-by-vendor issue?
I ask because I have an Asrock 170 Extreme4 here waiting for a 6600K.
However I won't be mounting any cinder block coolers on it!
Not motherboards, but the actual PCB on the CPU itself.
All Skylake CPU's are thinner than Haswell, yes.
As long as you use a cooler that adheres to Intel's 50lb clamping force you'll have zero issues.