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Susquehannock said:Contrary to popular belief Aluminum will "bleed off" or dissipate
heat faster than Copper or Silver.
However, when the source is still active is another matter.
Q. Does Heatronics have specific distributors?
A. This moment, we don't have any distributors who stock and sell our products. Contact us directly even if you want standard products.
Also, unlike heat pipe heat sinks, there is no limitation to the position to install Heatlane™ heat sink.* with some restrictions
Originally posted by The8ball @ ocau forums
There was another company who make heatsink bases using the same technology, thermacore I think.
Any way, I emailed them about the possible application of this technology for the development of very high performance waterblocks.
I got hold of some documents outlining calculations of the thermal resistance imposed on heat flow by a plate of this sort.
Essentially, the thermal resistance could be broken down into a number of "components".
1. A thermal resistance associated with thermal energy conducting from the surface of the heat source through the casing material of the heat plate to the wick structure where the phase change takes place.
2. A thermal resistance associated with the phase change of the liquid into a vapour in the wick structure adjacent to the heat source.
3. Another thermal resistance relating to the "effective" conductivity of the space inside the heat plate which is modelled on the diffusion speeds of the vapur as well as the geomoetry of the heat plate in relation to the size and position of the heatsource.
4. One associated with the phase change from vapour back to liquid at the wick structure adjacent to the cooled surface.
5. And finally, another resistance associated with the conducting of thermal energy from the wick structure to the cooled surface.
This can then be compared with say a solid plate of copper/silver of the same dimensions which would form the base plate of your water block.
What I discovered plugging some numbers into the relevant formulae, was that 1,3,4 & 5 could be very small indeed, as the thickness of the casing is very thin, and the "effective" conductivity of the space inside is around 10,000W/m*k, and the phase change and conduction at the cooled surface are also very low because of the very nature of spreading it out over a much greater area.
The problem however, lies with number two.
Using rough estimates of the size of the core being 12mmX12mm and dissipating 75 Watts, the thermal resistance of this stage alone worked out to be greater than the entire thermal resistance of the white water as tested, and this is even before you figure in the 4 other resistances, though these were much less significant.
The reasons for this?
With efficient water block design, it is less important to have a base material allowing for greater spreading. If however, as with air cooling, there is quite some difficulty in being able to dissipate all of the heat from directly above the heat source, the advantage of the last 3 resistances being so low come into their own.
And this is what they are being used for. Relatively low cost, but moderately high performance mass produced heatsingks, for any form of heat generating IC, including the P4. The allow for better than cheap/stock aircooling, but will never compete with top end air cooling on a direct performance comparison. They are an improvement to the really poor performance end of the aircooled HS prosuct.
8-ball
UberBlue said:
i2fast4u said:On my snowmobile, I have a 200mm fan very similar to computer fans and I have yet to have any problem with it shorting from water and plugging my radiator, I dont know how bad your water is where you are, but its not too bad here. Its only a suggestion at the moment, I will be putting this theory into motion as soon as I get some funds arranged for my new rig
I don’t think I agree with this guy’s conclusion. If you made a high end Heat-sink out of this material it should perform better.
I'd like to see it done...by say..thermalright.