i'm literally thinking about building a heatpipe system, which the ends would be at both cpu's clamped in blocks, and clamped blocks in the center that the evap would mount to(for '4x4') i think a large block from cpu to cpu would be too much to cool/insulate/hold a load, i think 4 at minimum/6 at maximum heatpipes would be needed, but i dunno, got some time to figure out exactly what im going to do
you should know that load on a pressler @ 1.6v this thing dosn't go above -30c....it's a monster
only other option is send it back to jinu and see if he can mod it to a dual evap system, have it still fit in the case, or like i've said, sell it and get something different, like the UFO case build he did, which would almost definitely be able to have a dual evap system in it
decisions decisions....
there is still a chance i can go for the record, my friend got the same unit, and has every single same setup as me, same mobo, same processer(0343 MPMW), BUT, he's now afraid to attempt to hook it up due to my results, not to mention the problems that have to be worked out in general
the dfi board, like most socket-a boards, have the socket at the very top of the mobo, which in the LianLi case, puts it at the bottom, which is right up against the seperating wall, in this position it's also to the far right, which makes you really have to stretch the evap line to get it to mount...which is scary to say the least, add to that the rear insulation+backplate+screw heads=taller than stand-offs, and it becomes scarier and requires cutting on the mobo tray...
so he's waiting on his next build too before he uses his unit, to which like me, will be going '4x4'(we're draftsman)
so when we build new systems, we'll work together to try and go for these records...