- Joined
- Mar 10, 2004
- Location
- Texas
When I got the SLK900 I lapped it then applied As5 and for a template for the paste I marked off spots on the side of the hs and used those marks to make a template. The As5 is only as thick as the depth of the tape. Should I have made a bit thicker. The reason I ask, I have clocked my proc. up to 2.3GHz and while testing (prime and folding) my system would crash. I under clocked it and started doing some tests at stock speeds. When I went back to stock my temps didnt change and actually might have gone up a degree. I am doing a memtest as we speak and so far no errors. As I am going through things that it might be As5 always come into mind. Do you think the depth of the tape is actually enough paste to cool as it should.