Hi guys. I just thought I would pop back and say that since repair my 8800 Ultra has been utterly flawless.
However I did want to stress that propping the card up on stilts or balls is a bad idea. Both sides of the card have components on and if you leave air underneath them when baking gravity will take over.
When I baked mine I kept it flat against the dull side of the foil. Basically I covered the baking tray with foil leaving the dull side up as the shiny side will reflect the heat. However, I put the card directly on it. The alu will not melt and nothing will stick to it, so putting it on balls or stilts is a false economy.
I also applied pressure to the culprits of failure (main GPU and RAMDAC) by wrapping lots of coins in foil and standing them on the chips. This prevents the chip lifting as the heat melts the solder forming hourglass shapes that are prone to failing. It also pushes the chips back down into the solder forming a good bond.
However I did want to stress that propping the card up on stilts or balls is a bad idea. Both sides of the card have components on and if you leave air underneath them when baking gravity will take over.
When I baked mine I kept it flat against the dull side of the foil. Basically I covered the baking tray with foil leaving the dull side up as the shiny side will reflect the heat. However, I put the card directly on it. The alu will not melt and nothing will stick to it, so putting it on balls or stilts is a false economy.
I also applied pressure to the culprits of failure (main GPU and RAMDAC) by wrapping lots of coins in foil and standing them on the chips. This prevents the chip lifting as the heat melts the solder forming hourglass shapes that are prone to failing. It also pushes the chips back down into the solder forming a good bond.