Thermal Pads vs Putty

[ThunderSpirit]

I am trying to fill a gap between a camera sensor and the aluminum body which is within several millimeters of the back of the sensor. I want to avoid thermal paste because I think it would make a big mess and possibly not work. I have decided to go with either a thermal pad http://www.ebay.com/itm/Thermagon-6...hermal_Compounds_Supplies&hash=item19e77c25c1 or thermal putty http://www.ebay.com/itm/Fujipoly-11...900?pt=LH_DefaultDomain_0&hash=item3f27a8e1b4 to fill the gap but I am not sure which will be a better choice? I need it to pull heat away, and later on I will be connecting a peltier unit to the back of the camera casing to cool the sensor directly from the outside of the unit. I just need to know which type of gap filler will be the better connection in terms of heat transfer and cooling. Here is a link to a project identical to mine, only he did not use a gap filler pad on his camera http://www.astrotreff.de/topic.asp?TOPIC_ID=150474 thanks

 

[EarthDog]

I do not know off hand, however, I would imagine if you go to the manufacturers website it will tell you how much heat each medium can move.

GL!

 

[NiHaoMike]

Use an aluminum or copper shim to fill in most of the gap, then use thin thermal pads for the remainder.