Today I have something interesting ( at least for me ) as I had no chance to test Super Talent memory for a long time. Presented memory kit contains two 8GB modules rated at DDR4-3600 17-18-18 1.35V.
Some overclockers know Super Talent because of one of the best DDR3 modules based on Elpida Hyper IC. Later we haven't heard much about this brand.
Super Talent Project X has low profile heatsinks ( I could say standard height but somehow it's now called low for some reason ) so should work with all cooling solutions. Actually you could expect it to be a bit more flashy as the highest DDR4 series. It doesn't change fact that memory itself look good. PCB is black and modules are single rank. Considering IC availability, I'm almost sure it's Samsung B die under the heatsinks but I don't really want to remove them ( at least not now ).
Interesting is that on the package there is info about DDR4-3600 and 17-18-18 main timings while on the memory itself there are 16-18-18 timings. XMP profile is 3600 17-18-18 and 1.35V so like it's described on the package.
Inside the package are only 2 memory modules and nothing else but I guess that no one needs anything more to install memory on the motherboard.
*** photos will be added later ***
Tests were performed on ASUS Maximus IX Apex motherboard and i7 [email protected] ( so it will be comparable with my previous tests and results on Skylake CPUs ).
XMP profile works without issues.
Memory is overclocking quite good what you can see in the next post.
Some overclockers know Super Talent because of one of the best DDR3 modules based on Elpida Hyper IC. Later we haven't heard much about this brand.
Super Talent Project X has low profile heatsinks ( I could say standard height but somehow it's now called low for some reason ) so should work with all cooling solutions. Actually you could expect it to be a bit more flashy as the highest DDR4 series. It doesn't change fact that memory itself look good. PCB is black and modules are single rank. Considering IC availability, I'm almost sure it's Samsung B die under the heatsinks but I don't really want to remove them ( at least not now ).
Interesting is that on the package there is info about DDR4-3600 and 17-18-18 main timings while on the memory itself there are 16-18-18 timings. XMP profile is 3600 17-18-18 and 1.35V so like it's described on the package.
Inside the package are only 2 memory modules and nothing else but I guess that no one needs anything more to install memory on the motherboard.
*** photos will be added later ***
Tests were performed on ASUS Maximus IX Apex motherboard and i7 [email protected] ( so it will be comparable with my previous tests and results on Skylake CPUs ).
XMP profile works without issues.
Memory is overclocking quite good what you can see in the next post.
