Not that I was really a part of this thread, but I graduated with a B.S. in Physics. Basically, I took a few classes that dealt with electronics, and on top of that I took two electronics courses (one as an elective).
That picture two posts up of the melted solder at the bottom of your board... I must say that, in my opinion, the more your MOSFETs melt the bottom the closer they will get to the board. The closer they get to the board, the more they will get hot. I would put heatsinks on that very soon.
Same goes for capacitors, if they are getting too hot (even if they're not leaking yet)... you're already deteriorating its purpose. You're weakening them as they keep running hot, and if they melt the bottom solder they will only get closer to your board; thus, making it hotter and hotter. When I used to build electronic kits we were taught to leave a space of about (not sure EXACTLY how much) 1/8" from the board... better for heat dissipation. Basically, if you're going to resolder new caps make sure you leave a space between the board and the cap.