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pics of applied thermal compound on 3900x
- Thread starter leo5111
- Start date
- Joined
- Apr 19, 2012
You would apply it the same way you prefer to apply it. It doesn't matter that it has 12 or 8 cores....
But if people want to share pics of how they do it, would be pretty cool. (cpu any?)
But if people want to share pics of how they do it, would be pretty cool. (cpu any?)
- Joined
- Nov 21, 2018
Don't have picture but I made this for you.
Yellow is the gold aarow I'm the corner.
Gray is the ihs
Red lines are how I do my thermal paste.
Yellow is the gold aarow I'm the corner.
Gray is the ihs
Red lines are how I do my thermal paste.
- Joined
- Nov 21, 2018
3900x.
Little ones are your chaplets. The big one everything else.
Note the gold arrow when you are putting the lines on
Little ones are your chaplets. The big one everything else.
Note the gold arrow when you are putting the lines on
Chaplets... 
Just a bb to pea sized dot in the middle is fine. The pressure from mounting pushes it to all the right places. I typically apply with the larger dot in the middle and four small dots in the corners. Making a line over the cores in any cpu really wont make a difference.
Just a bb to pea sized dot in the middle is fine. The pressure from mounting pushes it to all the right places. I typically apply with the larger dot in the middle and four small dots in the corners. Making a line over the cores in any cpu really wont make a difference.
Last edited:
- Joined
- Dec 7, 2013
I do the same as Earth dog. Mid-sized pea in the middle and a very small pea 2/3 of the way to each corner.
When I take my cooler off it usually looks like full or almost full coverage. Sometimes there are some little areas that don't have paste. If a spot was "missed" it will be a little wedge along the edge, between my smaller dots (edge/middle). Sometimes there is a little tiny bit of overflow.
When I take my cooler off it usually looks like full or almost full coverage. Sometimes there are some little areas that don't have paste. If a spot was "missed" it will be a little wedge along the edge, between my smaller dots (edge/middle). Sometimes there is a little tiny bit of overflow.
- Joined
- Apr 19, 2012
Push out is a pretty normal thing no matter the way the paste is applied.
I've always used a spread method. I start with a line down the middle and spread from there to the edges.
This method leave a small mound in the middle which helps ensure air doesn't get trapped. I do the same with naked chips.
But with testing leaving the line, a dot, an X ect, as long as there is enough paste you "should" have some push out.
When you see push out, that's actually good indicating paste has spread thoroughly across the IHS plate.
If lapping IHS plate and cooler surfaces, you should be able to use slightly less thermal interface material and have much better mating surfaces.
I've always used a spread method. I start with a line down the middle and spread from there to the edges.
This method leave a small mound in the middle which helps ensure air doesn't get trapped. I do the same with naked chips.
But with testing leaving the line, a dot, an X ect, as long as there is enough paste you "should" have some push out.
When you see push out, that's actually good indicating paste has spread thoroughly across the IHS plate.
If lapping IHS plate and cooler surfaces, you should be able to use slightly less thermal interface material and have much better mating surfaces.
