- Joined
- Sep 16, 2003
- Location
- Knoxville, TN
Ive gotten this info from an unnamed source and s/he will remain this way.
Anyhoo:
The leaders of both Winbond Dram and Twinmos Dram are very close friends. In a shady/under the table deal, Winbond agreed to ship raw "bh type" ICs to Twinmos. This IC then became Winbond UTT.
OCZ saw this in their fabs and thus rebranded the Twinmos and called it OCZ VX.
In actuality there are actually several UTT dies. Which are currentally being fabed in an Infineon factory side by side the Winbond stuff. Infact UTT has alot of roots in Infineon tech.
Overall there are 3 distinct types of UTT / BH type dies which are made in the *SAME* fab plant. One is found in ProMOS/Mosel as I had earlier suspected and confirmed. The other is pure Infineon based and the final is made by winbond themselves.
While the others are technically UTT dies they are not capable of the 222, even a high number of WInbond units are not. High enough that only OCZ decided to use it in its 2-2-2 form. Other companies had looked at such advances but the cost per unit was too high to justify it.
Basically in short the only good binned UTT is found in OCZ and Twinmos directally. All the others are "failed" UTT dies similar to what we know as CH5.
However I will stress that the UTT is NOT BH5 at all. They are made on different wafers and are a differnt die size wholly. Winbond does not plan to remake any of the true BH series and is unsure how long they will even make UTT.
I thought you guys would like to hear the truth for a change
Anyhoo:
The leaders of both Winbond Dram and Twinmos Dram are very close friends. In a shady/under the table deal, Winbond agreed to ship raw "bh type" ICs to Twinmos. This IC then became Winbond UTT.
OCZ saw this in their fabs and thus rebranded the Twinmos and called it OCZ VX.
In actuality there are actually several UTT dies. Which are currentally being fabed in an Infineon factory side by side the Winbond stuff. Infact UTT has alot of roots in Infineon tech.
Overall there are 3 distinct types of UTT / BH type dies which are made in the *SAME* fab plant. One is found in ProMOS/Mosel as I had earlier suspected and confirmed. The other is pure Infineon based and the final is made by winbond themselves.
While the others are technically UTT dies they are not capable of the 222, even a high number of WInbond units are not. High enough that only OCZ decided to use it in its 2-2-2 form. Other companies had looked at such advances but the cost per unit was too high to justify it.
Basically in short the only good binned UTT is found in OCZ and Twinmos directally. All the others are "failed" UTT dies similar to what we know as CH5.
However I will stress that the UTT is NOT BH5 at all. They are made on different wafers and are a differnt die size wholly. Winbond does not plan to remake any of the true BH series and is unsure how long they will even make UTT.
I thought you guys would like to hear the truth for a change
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