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Ditto!I can't wait to get my hands on one
Found something interesting this morning, not much info but here's the meat of it. http://www.eetimes.com/document.asp?doc_id=1331317&page_number=2
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So this bit of info is really cool. It shows that AMD engineers spent a long time trying to squeeze things together. For what reason, I don't know but its probably because they could do it since they were so focused on power saving. Even though Intel has a better Fin Pitch footprint than AMD/GoFo, AMD was able to pack everything into a smaller die. The relationship of memory to die size, or any sector to die size is non continuous and non sequitur. What you should take away from this is that AMD/GoFo is the only company to have gotten within 10% of the pitch footprint as AMD. Big deal for current leakage control, which in turn helps with OC % ability. How this affects the chip will be unknown for some time.
A Ryzen price list at shopblt.com with part numbers.
What about the extra space used for the Intel IGPU?
WithOut Fan?Ooh, the $316 one is more interesting to me... but interesting about BOX/PIB, suggesting that is... well... boxed? So, what does WOF mean? World Of Fun?
WithOut Fan?
Makes sense. So, basically like Intel K processors.