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A couple things strike me as curious. I don't doubt your claims, but am curious as to the possibilities.
"The temp's where higher than I liked from last weeks run ( +10c)..." - What would cause a +10c increase in a matter of 1 week? Surely your TIM didn't dry in a matter of 1 week. Do you have you rig sitting directly above a heat vent?
I'm not sure if it was the bigger 80mm and then a 120mm fan that I had pointed straight at the VRM/NB heat sink, trying to keep it cool. I was working on the OC of the RAM, with the new board, I was stuck at 208x @ 10-11-10-27 2T 1.65v
"When I pulled the block off the CPU, the TIM was at the edge's of the CPU & Block and also dry. I had no TIM over the middle of the CPU..." - Its possible you over tightened the block and squeezed the TIM from the center and pushed it all to the edges. Giving the appearance that it dried up.
This is very likely as I had not used AS Ceramique 2 on my CPU before. I had always used AS 5 but I was currently out. I had the AS Ceramique 2 from other projects that required non conductive TIM.
"...I could (and have) pulled the CPU out of the socket just from the TIM being glued to the block." - This is actually fairly common, even with proper TIM. It's best to rotate the block/HSF until the suction releases the CPU from the block. You probably know this, but I thought it was worth mentioning here.
"New motherboard that has WAY to many options to OC..." - You'll never hear me say this phrase. LOL. I say "Moar options, Moar betta!"
Anyhow, enough rambling. You should check you block and cpu to make sure they're not both convex. If you're not sure how we can assist in that.
Nice. Usually they don't need it. There was just another post today about the same issue. If HS is convex and CPU isn't, usually not bad unless it's really bad. But when they're both convex or both concave you'll never get good contact.
If the CPU is new you could try an RMA. Same with cooler. I would try that over lapping as that will void your warranty.
I talked to ASUS on Thursday, and was told that my motherboard had been accepted.
From what I've seen and read it's far more common for a CPU to be manufactured with a slight concave top. Not drastic enough to cause any performance issues as most cores are located in the center of the die. Heatsinks are most commonly the cause of extreme conve/concaving of CPU's from years of pressure and the sinks are not manufactured very precisely either. I was very surprised at how rough my NH-D14 base is. Most of the top heatsinks and water blocks now use springs and the screws are designed to be bottomed out to provide the proper tension all the time.
I think the worst case scenarios are when both are convex, pushing all the TIM out from between them or both Concave and not providing adequate contact.
Make sure to take pictures of your board and especially the CPU pins. I don't trust Asus one bit.