nd4spdbh2, Thanks for the pics. do you have the ICD before and after thermal data and could you post that as well?
The E4300 is similar to what I am seeing at xtremesystems As I noted there, the bent edges and corners act as reinforcement and are not going to flex a lot.
I was thinking filing a bevel on the edges and to relieve the contact area might as good as lapping and certainly faster to improve contact.
Paste is definitely going to be several times thicker and not hit the best bondline. Ideally the heat transfer should be IHS>Particle>Sink This is more like IHS>Particle, Particle Particle, Particle>Sink would tend to flatten the thermal performance between compounds
The stock E6600 Looks like it has great contact and pressure, Be interesting to see the digital mapping on both and the compared thermal delta's between the before and after compound tests