Moderate performance, low noise — Joe
SUMMARY: OK for moderate Socket A cooling.
The fins are made from thin copper sheets and appear to be “folded”, so that a number of fins are made from one long copper sheet and then soldered to the copper base. Each fin is about as thick as an index card, and double that when folded.
is 3mm thick, flat and highly polished.
The fan is aPower Logic Model #PL71D12HH; a 70 x 15mm unit rated at 30 cfm @ 3500 rpm (this sample ran at 4274 rpm). I found it to be not too noisy – I measured its noise at 58 dBA with a Radio Shack sound meter 8″ from the fan’s intake, less than a Delta 38 (about 69 dBA); Cho-Liang specs the noise at 38 dBA. It consumes about 2.6 watts, so it should be OK to use a motherboard fan header.
Mounting is fairly easy – the clip features a platform so that it can be easily grasped for finger mounting – no screwdriver required. The clip engages all three socket lugs – always a plus in my book.
In summary, a fairly conventional copper heatsink with a three pronged clip that is fairly easy to mount.
The CB0315U-17 was first tested on the CPU Die Simulator which gives results that are unaffected by motherboard influences. I then tested it on an Iwill KK266+, modified to read AMD CPU die temps, as an example of what users might see on their systems.
CPU Die Temp
CPU Back Temp
|Palomino 1200, Iwill KK266+|
C/W = Delta / CPU Watts
Interpreting C/W: For every watt (CPUw) that the CPU
consumes, the HSF will limit the CPU’s temperature rise to (C/W x CPUw)
plus the temperature at the HSF’s fan inlet. For example, at an ambient temp of 25 C, a C/W of 0.25 with a CPU radiating 50 watts means that CPU temp will increase 50 x 0.25 = 12.5 C over ambient temp, or 37.5 C. The lower the C/W, the better.
CPU Die Simulator results place the CB0315U-17 in the lower rank of heatsinks tested to date (Heatsink Ranking).
OK for moderate Socket A/370 cooling.
Thanks again to CHO-LIANG Thermal Technology for sending this our way.